Job posting at We have created a new position for an Engineer to join our operation – a wafer planarization and dicing facility that is part of a revolutionary fabrication process for making micro-devices.
Responsibilities
- Ensure that equipment is properly specified, designed and installed to provide continuous and reliable service
- Participate in process development, working with scientists and engineers to achieve continuous process improvement and stabilization
- Establish preventative maintenance program and spares program
- Scale up some of Microfabrica’s existing low-volume planarization and dicing equipment
- Keep existing tools operating properly
- Optimize current processes
Requirements
- This individual should have experience (3 years) in a production scale machine shop or manufacturing facility.
- Experience with planarization and machining of metals and with wafer dicing a plus
- Experience in either a thin film disk drive head, MEMS, or semiconductor background
- Knowledge of common planarization methods such as CMP, grinding, lapping, and polishing a plus but not required.
- Experience optimizing processes
- BS or graduate level degree in Mechanical Engineering, Chemistry, Chemical Engineering or Materials Science
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